- Define the requirement of SoC package substrate and/or Reference Application PCB
- Specify the outline of the circuit/artwork and define the verification method for it
- Do circuit/artwork design and validate them with the specified method
- Communicate engineers who design circuit and artwork
- Write deltaied technical reports on development outputs
- Knowledge of PCB board circuit/artwork design for semiconductor system boards
- Experience with simulation tools to perform signal quality evaluations
- Knowledge of phenomena that affect signal quality, such as transmission loss, reflections, and crosstalk
- Fundamental knowledge about memory devices and interfaces such as DDR, Flash, NVM is plus
- Fundamental knowledge about standards of communication interfaces such as MIPI, PCIe, and else is plus
- Fundamental knowledge in the electrical circuit of digital and analog Company Description
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Renesas Electronics Kodaira, 日本 フルタイムJob Description · SoC Timing Design Engineer or Leader. Timing design technology development, and product development by Static Timing Analysis and Timing Constraint design. · - Static Timing Analysis · Timing design by using EDA vendor's EDA tool · - Timing constraint design · T ...
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Renesas Electronics Kodaira, 日本 フルタイムJob Description · SoC Backend Design Engineer or Leader. Backend design technology development, and product development by Auto Place & Route tool or Physical layout. · - Auto Place & Route design: · P&R design by using EDA vendor's EDA tool · - Physical layout design · IO placem ...
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Renesas Electronics Kodaira, 日本 フルタイム· Job Description · Digital circuit design/verification for automotive SoC (R-Car series) · Bus and related IPs (DMAC, System MMU, Memory Controller, etc.) · Architectural study of Bus and related IP, integration into products, and logic verification · Bus performance evaluation ...
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Renesas Electronics Kodaira, 日本 フルタイム· Job Description · Digital circuit design/verification for automotive SoC (R-Car series) · Target IPs for development: CPU and related IPs (Interconnect, Interrupt, Debug/Trace function, etc.) · Making concept and target specificaiton from requirements · Making ground design of ...
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Renesas Electronics Kodaira, 日本 フルタイムJob Description · Digital circuit design/verification for automotive SoC (R-Car series) · Target IPs for development: CPU and related IPs (Interconnect, Interrupt, Debug/Trace function, etc.) · Making concept and target specificaiton from requirements · Making ground design of fu ...
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Renesas Electronics Kodaira, 日本 フルタイムJob Description · Digital circuit design/verification for automotive SoC (R-Car series) · Bus and related IPs (DMAC, System MMU, Memory Controller, etc.) · Architectural study of Bus and related IP, integration into products, and logic verification · Bus performance evaluation an ...
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Renesas Electronics Kodaira, 日本 フルタイムJob Description · Digital circuit design/verification related to IO, PAD, pin multiplex in automotive SoC (R-Car series) · Target IPs for development: IPs related to IO, PAD, pimultiplex logic · Specification design of pin multiplex for R-Car SoC IO · Digital circuit design/veri ...
SOC Package Substrate and Application Board Transmission Line Design Engineer - Kodaira, 日本 - Renesas Electronics
説明
Job Description
Responsible for SoC package substrate and/or application PCB, circuit and artwork
*The full details regarding your position scope as well as any future potential changes in work location and job scope will be provided during the interview process.
Qualifications SoC products for automotive applications are key parts for realizing the digitization and higher functionality of automobiles, and their evolution is unstoppable. In recent years, higher performance and higher functionality have been realized, and package substrates and application boards are required to meet advanced requirements (e.g., suppression of transmission loss and noise, assurance of signal quality, etc.).
This work involves circuit and artwork design and verification through simulation of signal quality in order to realize PCB boards for package and application systems that meet these requirements. This technology is central to the realization of large-scale systems using chiplets and multi-chip modules, which will improve significantly in the future, and this position will allow the candidate to learn a highly promising technology.